2026 Event Schedule

Artificial intelligence has upended the thermal equation, reshaping silicon architectures and accelerating the need for integrated, flexible, and scalable cooling strategies. In this session, Oakley Roberts, President of Data Centers at Trane Technologies, will reveal how co designed architectures, modular systems, and intelligent hybrid cooling are redefining performance, resiliency, and deployment speed for next generation AI data centers. Attendees will gain a clear view of how integrated thermal management can turn rising complexity into a competitive advantage.

Key Takeaways:

1. Why silicon bifurcation, density, and deployment velocity demand a shift from standardized cooling to engineered flexibility.

2. How early co design, reference architectures, and modular systems unlock faster, more predictable hyperscale and colocation deployments.

3. What integrated hybrid cooling and system level orchestration mean for achieving performance, efficiency, and resiliency at AI scale.