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ARPA-E COOLERCHIPS - Cooling Compute Systems Efficiently, Anytime, Anywhere

Peter de Bock  (Program Director, DOE Advanced Research Projects Agency - Energy, United States Department of Energy)

Rakesh Radhakrishnan  (Technology to Market Advisor, United States Department of Energy)

Brent Ridley  (Technology-to-Market Advisor, United States Department of Energy)

Location: Room 206

Date: Tuesday, April 16

Time: 11:05 am - 11:55 am

Pass Type: AFCOM Solution Provider, All Access Conference, Industry Conference, Standard Conference - Get your pass now!

Track: Emerging IT & Data Center Technologies

Session Type: Conference Session

Vault Recording: TBD

Audience Level: All Audiences

ARPA-E is the DOE's Advanced Research Projects Agency - Energy for transformational technologies

COOLERCHIPS is a $42M program that will develop transformational, highly efficient, and reliable cooling technologies for data centers. The target for COOLERCHIPS is to reduce total cooling energy expenditure to less than 5% of a typical data center's IT load at any time and any U.S. location for a high-density compute system. A data center's total cooling energy is the energy needed to ensure that all heat generated from its IT and non-IT loads is rejected. Reducing data center cooling energy will reduce the operational CO2 footprint of data center operations. COOLERCHIPS technologies will achieve these goals by dramatically reducing the thermal resistance of heat rejection, which will allow for coolants to exist at temperatures much closer to operating temperatures of the latest generation of chips (targeting <10°C difference between chip and coolant). This will result in more efficient heat removal from the facility. The program will develop solutions for high volumetric compute density systems of >80kW/m3, equivalent to about >3kW per server. COOLERCHIPS aims to be commercially competitive with current state-of-the-art solutions by offering a lower total cost of ownership without compromising data center reliability and availability.


  • Information about a $42M research program to advance cooling technologies for data centers
  • Learn about cooling technologies for data centers
  • Get an introduction to advanced concepts that are being considered for 5-10 years future chipsets
  • Learn about advances supported in modular high performance data centers