2026 Event Schedule

As data centers rapidly evolve to support high-performance computing (HPC) and AI-driven workloads, efficient thermal management is no longer optional - it is mission critical. This presentation introduces an innovative cooling concept and infrastructure, that redefines how heat is removed directly from the silicon, to the ambient. By transferring the thermal energy from the silicon to phase change cold plates, the energy collected into hot vapor releases the heat energy directly into the ambient via condensers. The system leverages the forces of physics to deliver the hot vapor to the condensers and the condensed liquid to the servers, maximizing efficiency while, minimizing power consumption.
The approach eliminates the need for water inside the data center entirely, ensuring zero water usage while enabling unprecedentedly low total data center PUE. By combining sustainability with performance, this breakthrough paves the way for the next generation of cooling methodologies that can keep pace with escalating compute demands.
Designed for efficiency, resilience, and scalability, this solution demonstrates how smarter, waterless cooling can address the industry's most pressing challenges: reducing environmental impact, cutting operational costs, and ensuring that data centers are prepared for the future of HPC and AI at scale.