2026 Event Schedule

As Open Rack V3 (ORv3) architectures evolve to support higher density AI workloads and centralized power delivery, data centers are facing new environmental management challenges. Higher thermal loads and changing airflow patterns require more precise monitoring of temperature, humidity, pressure, and potential water leak conditions. Updated Open Compute Project (OCP) specifications further reinforce the need for tighter environmental control to ensure performance and reliability at scale. In this session, Jason Chantelau will share insights into our latest ORv3 power infrastructure—including advancements in power shelf design and controller firmware—and how these innovations help operators maintain the environmental stability required for next generation AI deployments.

Attendees at the talk will be able to:

1. Understand the environmental challenges introduced by high density ORv3 rack designs, including thermal variability and the need for more precise monitoring.

2. Learn how next generation ORv3 power shelf and controller firmware architectures enable advanced power quality insights and sensor integration.

3. See how the ORv3 Smart Rack Controller enhances operational visibility and reliability through comprehensive monitoring of temperature, humidity, pressure, and leak-detection conditions.