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Data Center World Tech Talk: AI & Liquid Cooling - Nvidia, Intel & Vertiv Talk Implementation

Greg Stover  (Global Director - Hi-Tech Development, Vertiv)

Drew Tuholski  (Solution Engineer, Vertiv)

Mohammad Tradat, Ph.D  (Manager, Data Center Mechanical Engineering, Nvidia)

Dev Kulkarni Ph.D  (Sr. Principal Engineer - Thermal Architect, Intel)

Location: Room 207B

Date: Tuesday, April 16

Time: 3:00 pm - 3:50 pm

Pass Type: AFCOM Solution Provider, All Access Conference, Industry Conference, Pre-Conference Training, Standard Conference - Get your pass now!

Session Type: Tech Talk

Vault Recording: TBD

Next-Gen Chips are driving change and disruption in our data centers and infrastructure. Hear directly from AI disruptors and supporters Nvidia, Intel and Vertiv on drivers and challenges and how the industry can leverage AI technologies, by deploying new liquid cooling solutions and power strategies.

Takeaway

The AI Heat Wave Is Here!

Adoption of accelerated IT and high-performance computing (HPC) architectures is growing at a fast pace to meet the demands of AI workloads.

· Power consumption and heat generation from AI chips are significantly higher than current IT equipment loads. Legacy and new power and cooling infrastructure designs are being transformed as traditional cooling technologies will not measure up to the needs of the game changing AI workloads.

· Hot to ease the transition from air to hybrid air/liquid infrastructure.