Data Center World 2024
Innovating DC Infrastructure for AI at Scale
Rob Coyle (Community Technical Program Manager, Open Compute Project)
Location: Room 206
Date: Tuesday, April 16
Time: 1:00 pm - 1:50 pm
Pass Type: AFCOM Solution Provider, All Access Conference, Industry Conference, Standard Conference - Get your pass now!
Track: Emerging IT & Data Center Technologies
Session Type: Conference Session
Vault Recording: TBD
Audience Level: All Audiences
The rapid growth of AI has heightened the demand for computational power, necessitating innovative data center infrastructure solutions. The Open Compute Project (OCP) provides a framework to efficiently accommodate AI hardware at scale. This session explores leveraging OCP principles to address AI workload challenges in data centers, focusing on connectivity, densification, and sustainability.
Participants will examine the importance of connectivity, exploring OCP's emphasis on high-speed networking, low-latency interconnects, and advanced fabric technologies for optimizing data transfer within AI clusters. Techniques like open network architectures and software-defined networking will be discussed. Densification strategies for AI data centers will be explored, including rack-scale architectures, modular designs, and high-density computing solutions, enabling efficient cooling, power management, and scalability. The discussion will also highlight sustainability considerations, such as energy-efficient designs, renewable energy integration, and heat transfer approaches.
Topics like power management, waste heat recovery, and green certifications will be covered, showcasing sustainable practices in AI infrastructure. Attendees will gain insights into leveraging OCP to address AI workload challenges, optimize connectivity, maximize data center density, and promote environmental responsibility.
- Gain insights into leveraging the Open Compute Project (OCP) to address the unique challenges of housing AI hardware at scale in data centers.
- Understand the significance of connectivity in AI data centers and explore OCP's approaches to optimizing high-speed networking and low-latency interconnects.
- Learn about innovative densification strategies enabled by OCP, including rack-scale architectures and modular designs, to accommodate a higher density of AI hardware while ensuring efficient cooling and scalability.
- Explore sustainable practices in AI data centers, including energy-efficient designs, renewable energy integration, and efficient cooling mechanisms, to promote environmental responsibility.