Data Center World 2025

This session features a distinguished panel of PhD-level scientific experts who will explore the increasingly complex and interconnected components needed to deliver high-performance IT and data center infrastructure.

It takes roughly four years to build a greenfield data center – from site selection to rolling in racks. In the same time period, our industry will see chip TDPs triple. This highlights the urgent need for infrastructure designs made today to account for three to four generations of chip releases. We are no longer building for the familiar.

The cooling infrastructure necessary to support next-generation chips requires a radical transformation. Experts from Intel, Accelsius, and Vertiv (delivering an ecosystem perspective) will discuss the critical evolution in cooling technology, with a specific focus on two-phase liquid cooling. As air cooling and single-phase liquid cooling reach their limits, two-phase, direct-to-chip cooling is emerging as the most effective solution for managing the thermal loads of upcoming CPUs and GPUs.

Takeaway

*Understand cooling requirements for future chips.
*Explore liquid cooling options.
*Understand how to select a future-proof CDU.
*Learn how to design efficient facility-to-CDU water loops.
*Discover how to adopt liquid cooling in brownfield data centers.